Compact camera module

ABSTRACT

A compact camera module is disclosed that is capable of preventing adhesion of dust to an image pickup device in the compact camera module. The compact camera module includes a lens unit including a lens and a lens holder holding the lens therein and an image pickup unit attached to the lens unit. The image pickup unit includes a circuit board, an image pickup device on the circuit board, a cover member arranged on the circuit board to cover the image pickup device, and an optical filter arranged with respect to the cover member to face the image pickup device. The image pickup device is disposed in a substantially closed space formed by the circuit board, the cover member, and the optical filter. After the image pickup device is mounted on the circuit board, the image pickup device is disposed in the substantially closed space, and therefore, the compact camera module can be assembled with no occurrence of dust adhesion to the image pickup device.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a compact camera module,particularly, a compact camera module installed in an electronic devicesuch as a cellular phone.

[0003] 2. Description of the Related Art

[0004]FIG. 1 is a partial cross-sectional view of a compact cameramodule 1 of the related art. In the compact camera module 1, a squarecircuit board 3, on which a CCD solid image pickup device 2 is mounted,is attached to the bottom of a lens unit 4. The lens unit 4 includes acylindrical lens holder 13 in which lenses 10 and 11 and an opticalfilter 12 are accommodated, and a housing 14 having an upper cylindricalportion 14 a and a lower box-shaped portion 14 b. The lens holder 13 isfastened to the cylindrical portion 14 a of the housing 14 by threads15. If tuning the lens holder 13, the lens holder 13 moves along anoptical axis, thereby adjusting the focus point of the compact cameramodule 1. This compact camera module 1 is mounted on a mounting board.

[0005] If dust adheres to the surface 2 a of the CCD solid image pickupdevice 2, the quality of the obtained image is degraded. In addition,because the surface 2 a of the CCD solid image pickup device 2 is formedby a micro-lens structure and is delicate, it is not easy to remove awaythe dust adhering to the surface 2 a. Therefore, it is important toprevent dust from adhering to the surface 2 a of the CCD solid imagepickup device 2.

[0006] Japanese Laid Open Patent Application No. 2001-188155 discloses atechnique related to this issue.

[0007] One problem with the cameral module 1 shown in FIG. 1 is that,when assembling the cameral module 1 after the CCD solid image pickupdevice 2 is mounted on the circuit board 3, the CCD solid image pickupdevice 2 is exposed to atmosphere until the circuit board 3 is attachedto the bottom of the lens unit 4, and dust may adhere to the surface 2 aof the CCD solid image pickup device 2 in the assembling process. Thiscaused a problem in production of the compact camera module in a largequantity.

SUMMARY OF THE INVENTION

[0008] According to a first aspect of the present invention, there isprovided a compact camera module including a lens unit including aplurality of lens; and an image pickup unit including an image pickupdevice. The image pickup unit is independent from the lens unit andattached to a bottom of the lens unit. The image pickup device isdisposed in a substantially closed space in the image pickup unit.

[0009] According to a second aspect of the present invention, there isprovided a compact camera module comprising a lens unit including a lensand a lens holder holding the lens therein and an image pickup unitattached to the lens unit. The image pickup unit comprises a circuitboard; an image pickup device on the circuit board; a cover memberarranged on the circuit board to cover the image pickup device; and anoptical filter arranged with respect to the cover member to face theimage pickup device. The image pickup device is disposed in asubstantially closed space formed by the circuit board, the covermember, and the optical filter.

[0010] According to a third aspect of the present invention, there isprovided an image pickup unit for use in conjunction with a lens unit ina compact camera module, comprising a substantially closed space; and animage pickup device disposed in the substantially closed space.

[0011] According to a fourth aspect of the present invention, there isprovided an image pickup unit for use in conjunction with a lens unit ina compact camera module, comprising a circuit board; an image pickupdevice-on the circuit board; a cover member arranged on the circuitboard to cover the image pickup device; and an optical filter arrangedwith respect to the cover member to face the image pickup device. Theimage pickup device is disposed in a substantially closed space formedby the circuit board, the cover member, and the optical filter.

[0012] According to a fifth aspect of the present invention, there isprovided a lens unit for use in conjunction with an image pickup unit ina compact camera module, comprising a lens having a cutout; and a lensholder that holds the lens therein. A ventilation channel is formedbetween a wall of the cutout and the lens holder.

[0013] According to a sixth aspect of the present invention, there isprovided a method of producing a compact camera module, comprising thesteps of forming an image pickup unit wherein an image pickup device isdisposed in a substantially closed space; and attaching the image pickupunit to a lens unit.

[0014] According to a seventh aspect of the present invention, there isprovided a method of producing an image pickup unit for use inconjunction with a lens unit in a compact camera module, the methodcomprising the steps of installing an image pickup device on a circuitboard; covering the image pickup device with a cover member to disposethe image pickup device in a substantially closed space; and arrangingan optical filter with respect to the cover member to face the imagepickup device.

[0015] These and other objects, features, and advantages of the presentinvention will become more apparent from the following detaileddescription of the preferred embodiments given with reference to theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016]FIG. 1 is a partial cross-sectional view of a compact cameramodule of the related art;

[0017]FIG. 2A is a perspective view of a compact camera module 20according to an embodiment of the present invention;

[0018]FIG. 2B is a perspective view of a lens unit 30 of the compactcamera module 20;

[0019]FIG. 2C is a perspective view of a solid image pickup unit 40 ofthe compact camera module 20;

[0020]FIG. 3A is a cross-sectional view of the compact camera module 20;

[0021]FIG. 3B is a cross-sectional view of the compact camera module 20along the line BB in FIG. 3A;

[0022]FIG. 4A is a cross-sectional view of the lens unit 30;

[0023]FIG. 4B is a cross-sectional view of the solid image pickup unit40;

[0024]FIG. 5 is a bottom view of a circuit board 42 of the compactcamera module 20;

[0025]FIG. 6A through FIG. 6C are exploded perspective views ofcomponents of the solid image pickup unit 40, where FIG. 6A is aperspective view of the upper side of a cover member 51, FIG. 6B is aperspective view of the lower side of the cover member 51, and FIG. 6Cis a perspective view of the circuit board 42 with electrodes formedthereon;

[0026]FIG. 7A is a perspective view showing mounting of the compactcamera module 20 on a mounting board 60; and

[0027]FIG. 7B is a perspective view showing mounting of the compactcamera module 20 on a mounting board 70 having a socket 71.

DESCRIPTION OF THE EMBODIMENTS

[0028] Below, embodiments of the present invention are explained withreference to the accompanying drawings.

[0029]FIG. 2A is a perspective view of a compact camera module 20according to an embodiment of the present invention.

[0030] As illustrated in FIG. 2A, the compact camera module 20 shown inFIG. 2A includes a lens unit 30 and a solid image pickup unit 40attached to the lens unit 30. The lens unit 30 and the solid imagepickup unit 40 are independent units. In other words, the compact cameramodule 20 can be disassembled into the lens unit 30 and the solid imagepickup unit 40.

[0031]FIG. 2B is a perspective view of the lens unit 30 of the compactcamera module 20.

[0032] As illustrated in FIG. 2B, the lens unit 30 includes acylindrical lens holder 33 and a cylindrical housing 34. The lens holder33 has a disc-shaped upper lid 33 a, and at the center of the upper lid33 a, there is an opening 33 b allowing entrance of light. The housing34 has a square flange 34 a at the bottom thereof for attaching thesolid image pickup unit 40 to the lens unit 30.

[0033]FIG. 2C is a perspective view of the solid image pickup unit 40 ofthe compact camera module 20.

[0034] As illustrated in FIG. 2C, and FIG. 3A, the solid image pickupunit 40 includes a solid image pickup device 41, a square circuit board42, and a square cover member 51 disposed on the upper side of thecircuit board 42. The cover member 51, for example, is formed from asynthesized resin. An optical filter 50, for example, in disc shape, isdisposed on the cover member 51. In the cover member 51, there is formedan air hole 51 k penetrating a square upper lid 51 b of the cover member51 (refer to FIG. 4B).

[0035]FIG. 3A is a cross-sectional view of the compact camera module 20.

[0036]FIG. 3B is a cross-sectional view of the compact camera module 20along the line BB in FIG. 3A.

[0037]FIGS. 4A and 4B are cross-sectional views of the lens unit 30 andthe solid image pickup unit 40, respectively.

[0038] As illustrated in FIG. 3A and FIG. 4B, the solid image pickupdevice 41 is installed on the square circuit board 42 of the solid imagepickup unit 40, by way of example, the solid image pickup device 41 maybe a CCD image pickup device, or the solid image pickup device 41 may bea MOS imaging sensor.

[0039] The optical filter 50 is arranged to be above the image pickupdevice 41 and separated from the image pickup device 41 by a distance ofa. In the solid image pickup unit 40, there is a substantially closedspace 45, that is, the space 45 is substantially sealed from theoutside. The image pickup device 41 is located in the space 45.

[0040] As illustrated in FIG. 4A and FIG. 3B, in the lens unit 30, alens 31 and a lens 32 are accommodated in the lens holder 33. The lensholder 33 is fastened to the housing 34 via threads 35. When the lensholder 33 is turned along the threads 35, the lens holder 33 moves alongan optical axis OA (referring to FIG. 3A), which adjusts the focus pointof the compact camera module 20. Further, cutouts 31a (for example,D-shaped cutouts) are formed in the lens 31, and cutouts 32 a are formedon the lens 32 for indicating orientation of the lenses 31 and 32. Notethat although only one cutout 31 a and one cutout 32 a are illustratedin FIG. 4A, there are a plural number of cutouts 31 a in the lens 31 anda plural number of cutouts 32 a in the lens 32.

[0041] Inside the lens unit 30, there is a ventilation channel 35. Theventilation channel 35 includes a first portion 35 a and a secondportion 35 b which are in communication with each other, and theventilation channel 35 extends between an opening 36 in the lower sideof the lens unit 30 and the opening 33 b in the upper lid 33 a.

[0042] The first portion 35 a of the ventilation channel 35 is the spacebetween the cutouts 31 a on the lens 31 and the cutouts 32 a on the lens32. The first portion 35 a of the ventilation channel 35 is the spacebetween the cutouts 31 a and cutouts 32 a and the lens holder 33, andextends from the opening 36 in the Z1 direction. Thus, without formingadditional grooves or the like on the inner surface of the lens holder33, a portion of the ventilation channel 35 is obtained.

[0043] The second portion 35 b of the ventilation channel 35 is formedbetween the upper surface of the lens 31 and a groove in the lowersurface of the lid 33 a. The second portion 35 b of the ventilationchannel 35 extends from the opening 33 b in the X1 direction and is incommunication with the first portion 35 a.

[0044] As illustrated in FIG. 3A and 3B, an air filter 38 is disposed inthe upper part (Z1 side) of the first portion 35 a of the ventilationchannel 35.

[0045] As illustrated in FIG. 4B, and FIG. 6A and FIG. 6B, the covermember 51 includes the square upper lid 51 b and a square frame 51 cjoined with the periphery of the square upper lid 51 b. The air hole 51k is formed in the upper lid 51 b.

[0046]FIG. 5 is a bottom view of the circuit board 42 of the compactcamera module 20.

[0047] The circuit board 42 is in square-shaped, and three corners 42 a,42 b, and 42 c thereof are shaped into arcs, and the other corner 42 dis beveled. That is, the circuit board 42 is asymmetric with respect toa central line CL.

[0048] The circuit board 42 and the image pickup device 41 are mountedwith respect to each other. With the circuit board 42 being asymmetric,the orientation of the image pickup device 41 with respect to thecircuit board 42 can be easily determined before mounting.

[0049]FIG. 6A through FIG. 6C are exploded perspective views ofcomponents of the solid image pickup unit 40.

[0050]FIG. 6A is a perspective view of the upper side of the covermember 51 of the solid image pickup unit 40, FIG. 6B is a perspectiveview of the lower side of the cover member 51, and FIG. 6C is aperspective view of the circuit board 42 having electrodes formedthereon.

[0051] As illustrated in FIG. 6A and FIG. 6B, the cover member 51 hasthree legs 51 d, 51 e, and 51 f, to be joined with the corners 42 a, 42b, 42 c of the circuit board 42, respectively. In the four sides of theupper lid 51 b, recesses 51 g, 51 h, 51 i, and 51 j are formedrespectively.

[0052] As illustrated in FIG. 6C, a number of electrodes 43 are formedon the side surfaces of the circuit board 42, and among these electrodes43, ground electrodes 43G are formed. The ground electrodes 43G areformed on the side surface of the circuit board 42, and extend up to theupper surface of the circuit board 42.

[0053] With the above described configuration, the legs 51 d, 51 e, 51 fof the cover member 51 are joined with the corners 42 a, 42 b, and 42 cof the circuit board 42. Thereby, the cover member 51 is posed to facethe circuit board 42. The lower ends of the square frame 51 c areadhered to the four sides of the circuit board 42 by using athermosetting adhesive agent, for example. The four sides of the squareframe 51 c are in contact with the grounding electrodes 43G.

[0054] Furthermore, for example, referring to FIG. 3A, the lens unit 30is installed on the solid image pickup unit 40 and is set to apredetermined position, and the flange 34 a (FIG. 2B and FIG. 3B) of thehousing 34 adheres to the upper lid 51 b of he cover member 51 by usinga thermosetting adhesive agent, for example. The opening 36 and the airhole 51 k are in communication with each other through a gap 39 betweenthe holder 33 and the cover member 51. The space 45 is in communicationwith the outside through the air hole 51 k, the gap 39 and theventilation channel 35. The opening 33 b is the exit of the ventilationchannel 35 and, as illustrated in FIG. 3A, the opening 33 b isrelatively far from the circuit board 42.

[0055]FIG. 7A is a perspective view showing mounting of compact cameramodule 20 on a mounting board 60.

[0056] As illustrated in FIG. 7A, the compact camera module 20 can bedirectly mounted on a mounting board 60 by soldering.

[0057] On the mounting board 60, electrode pads 61, and ground electrodepads 61G are formed corresponding to the electrodes 43 and the groundelectrodes 43G on the side surface of the circuit board 42.

[0058]FIG. 7B is a perspective view showing mounting of the compactcamera module 20 on a mounting board 70 having a socket 71.

[0059] As illustrated in FIG. 7B, the compact camera module 20 can alsobe mounted on a mounting board 70 by using the socket 71. The socket 71includes a square frame 72 and contacts 73 arranged in a line on theinner surface of the frame 72. The frame 72, for example, is formed froma synthesized resin, and is shaped in correspondence with the circuitboard 42 of the compact camera module 20. A corner 72 a of the frame 72is beveled to be in correspondence with the beveled corner 42 d of thecircuit board 42 as illustrated in FIG. 5. In addition, the frame 72 hasa projecting engagement member 72 b.

[0060] When mounting the compact camera module 20 on the mounting board70, the beveled corner 42 d of the circuit board 42 is aligned with thebeveled corner 72 a of the frame 72, and then the compact camera module20 is inserted into the socket 71 with an appropriate orientation. Dueto this, the recesses 51 g through 51 j are engaged with the engagementmembers 72 b, the electrodes 43 and the ground electrodes 43G are incontact with the contacts 73, and thereby the compact camera module 20is mounted on the mounting board 70.

[0061] The orientation of the compact camera module 20 when the circuitboard 42 is to be inserted into the socket 71 is determined by thebeveled corner 42 d of the circuit board 42, and with otherorientations, the compact camera module 20 cannot be fit into the socket71.

[0062] Below, an explanation is made of production of the compact cameramodule 20 having the above configuration, for example, for massproduction of the compact camera module 20.

[0063] The compact camera module 20 can be fabricated by combining thelens unit 30 and the solid image pickup unit 40 after the lens unit 30and the solid image pickup unit 40 are fabricated separately in largequantiy.

[0064] The solid image pickup unit 40 is obtained by attaching the covermember 51.to the circuit board 42 with the solid image pickup device 41installed thereon. When fabrication of the solid image pickup unit 40 iscompleted, the solid image pickup device 41 is accommodated in the space45 and substantially sealed from the outside, and from then on the solidimage pickup device 41 is substantially sealed from the outside. Hence,when fabrication of the solid image pickup unit 40 is completed, thesolid image pickup device 41, specifically, the surface thereof, isunder protection. As a result, the time length when the solid imagepickup device 41 is exposed to the outside is greatly reduced, and dustcan hardly adhere to the surface 41 a of the solid image pickup device41. Thus, it is not necessary, or at least less likely necessary toclean the surface 41 a of the solid image pickup device 41.

[0065] When attaching the solid image pickup unit 40 to the lens unit30, a location where dust adhesion may occur is the upper surface 50 aof the optical filter 50. Because the optical filter 50 is at a distanceof a from the solid image pickup device 41, the dust on the uppersurface 50 a of the optical filter 50 influences little quality ofimages obtained by the solid image pickup device 41.

[0066] Therefore, the compact camera module 20 of the present inventionis capable of suppressing influence of dust as much as possible,enabling fabrication of the compact camera modules with highreliability.

[0067] Because the upper surface 50 a of the optical filter 50 is simplya plane, as compared to the surface of the solid image pickup device 41,which is formed by a micro-lens structure and is delicate, it is easy toclean the upper surface 50 a to remove dust thereon.

[0068] In addition, because the solid image pickup unit 40 is astructure independent from the lens unit 30, the solid image pickup unit40 can be fabricated independently from the lens unit 30. Hence, evenwhen specification of the lenses 31 and 32 changes, thereby requiringchanges in the lens unit 30, fabrication of the solid image pickup unit40 can still be continued without being influenced by such changes. Thatis, the compact camera module 20 of the present invention is suitablefor mass production.

[0069] Below, an explanation is made of influence of a high temperatureon the compact camera module 20 having the above configuration. Forexample, the compact camera module 20 is heated to a temperatureexceeding 100 C. degrees.

[0070] When the compact camera module 20 is heated to a hightemperature, air in the space 45 expands. As illustrated in FIG. 3A,because the space 45 is in communication with the outside through theair hole 51 k and the ventilation channel 35, air in the space 45 canfreely expand, and thus the pressure in the space 45 does not increase.As a result, there is no force imposed on the cover member 51, anddeformation of the cover member 51 does not occur.

[0071] Similarly, in the lens unit 30, because the space between thelenses 31 and 32 and the lens holder 33 is in communication with theoutside through the ventilation channel 35, there is no rise of pressurein this space, and no force imposed on the lens holder 33, thus nodeformation of the lens holder 33.

[0072] Hence, when mounting the compact camera module 20 on the mountingboard 60, As illustrated in FIG. 7A, it is possible to pass through areflow oven. In other words, the compact camera module 20 can besoldered directly to the mounting board 60 by re-flow.

[0073] When attaching the solid image pickup unit 40 to the lens unit30, it is possible to use a thermosetting resin required to be heated toa high setting temperature for use. In addition, even when fabricatingthe solid image pickup unit 40, because the space 45 is in communicationwith the outside through the air hole 51 k, a thermosetting resin canalso be used to join the cover member 51 with the circuit board 42.

[0074] As illustrated in FIG. 3A, the opening 33 b, that is the exit ofthe ventilation channel 35, is on the upper side of the compact cameramodule 20, and the path length from the opening 33 b to the circuitboard 42 is relative very long (indicated by “A” in FIG. 3A). For thisreason, even when the solder scatters in the reflow soldering process,the solder drops can hardly enter the opening 33 b. Even if solder dropsenters the opening 33 b, the solder drops are caught by the air filter38. As a result, the configuration of the compact camera module 20 iscapable of preventing any foreign matters from entering the spacebetween the lens 31 and the lens 32 and the space 45.

[0075] When the compact camera module 20 is directly soldered to themounting board 60 by re-flow, static electrical charge generated on thelens unit 30 and the cover member 51 does not accumulate on the lensunit 30 and the cover member 51, but rather is discharged to a groundpattern of the mounting board 60 through the ground electrodes 43G andthe ground electrode pads 61G.

[0076] If the compact camera module 20 is mounted on the mounting board70 by inserting the compact camera module 20 into the socket 71, staticelectrical charge generated on the lens unit 30 and the cover member 51is discharged to a ground pattern of the mounting board 70 through thesocket 71.

[0077] Usually, a CCD image pickup device is sensitive to staticelectricity. In the compact camera module 20 of the present invention,because the cover member 51, which is the component closest to the solidimage pickup device 41, does not possess static charge, it is possibleto prevent electrostatic damage to the solid image pickup device 41.When a CMOS solid image pickup device is used instead of a CCD solidimage pickup device, or a DPS for signal processing is used, the sameeffect of preventing the electrostatic damage to the solid image pickupdevice 41 can be obtained.

[0078] While the present invention has been described with reference tospecific embodiments chosen for purpose of illustration, it should beapparent that the invention is not limited to these embodiments, butnumerous modifications could be made thereto by those skilled in the artwithout departing from the basic concept and scope of the invention.

[0079] Summarizing the effect of the invention, according to one aspectof the present invention, an image pickup device is disposed in asubstantially closed space.

[0080] Thereby, even in the process of assembling the compact cameramodule, the image pickup device is in a place where adhesion of dust tothe image pickup device can hardly occur. Thus, it is possible toassemble the compact camera module with little occurrence of dustadhesion, and it is possible to reliably assemble a high-quality compactcamera module.

[0081] In addition, because the image pickup unit is a structureindependent from the lens unit, the image pickup unit can be fabricatedindependently from the lens unit. Hence, even when specification of thelens in the lens unit changes, thereby requiring changes of the lensunit, fabrication of the image pickup unit can still be continuedwithout being influenced by such changes. That is, the compact cameramodule of the present invention is suitable for mass production.

[0082] According to another aspect of the present invention, an imagepickup device is disposed in a substantially closed space formed by acircuit board and a cover member. Therefore, after the image pickupdevice is mounted on the circuit board, the image pickup device isdisposed in an environment in which adhesion of dust to the image pickupdevice can hardly occur. Thus, it is possible to assemble the compactcamera module with little occurrence of dust adhesion, and it ispossible to reliably assemble a high-quality compact camera module.

[0083] By providing an optical filter can be cleaned easily, even dustadhesion occurs on the surface of the optical filter, the dust can beremoved easily. In addition, the optical filter is set relative far fromthe image pickup device, therefore the dust adhering to the surface ofthe optical filter has little influence on the quality of image obtainedwith the compact camera module.

[0084] Because the image pickup unit is a structure independent from thelens unit, the image pickup unit can be fabricated independently fromthe lens unit. Hence, even when specification of the lens in the lensunit changes, thereby requiring changes of the lens unit, fabrication ofthe image pickup unit can still be continued without being influenced bysuch changes. That is, the compact camera module of the presentinvention is suitable for mass production.

[0085] By providing an air hole in the cover member and the ventilationchannel in the lens unit, heat generated during the process ofassembling the compact camera module can escape easily, and thus,influence of air expansion is avoidable. As a result, the compact cameramodule can be mounted directly to a mounting board by re-flow withoutusing a socket.

[0086] By utilizing the existing cutouts, the ventilation channel can beformed easily without extra work of processing the lens holder. Becausethe exit of the ventilation channel is relatively far from a location ofsoldering when mounting the compact camera module, solder can hardlyenter into the ventilation channel.

[0087] By providing an air filter, it is possible to prevent solder frompassing through the ventilation channel to reach the image pickupdevice.

[0088] Due to the asymmetric configuration the image pickup unit, it ispossible to avoid errors in the orientation of the compact cameramodule, and facilitates engagement of the compact camera module into thesocket for mounting.

[0089] By providing a grounding terminal, static electrical chargegenerated during assembling can be removed away through the groundingterminal, and thereby, it is possible to prevent electrostatic damage tothe image pickup device.

[0090] This patent application is based on Japanese Priority PatentApplication No. 2003-096348filed on Mar. 31, 2003, the entire contentsof which are hereby incorporated by reference.

What is claimed is:
 1. A compact camera module, comprising: a lens unitincluding a plurality of lens; and an image pickup unit including animage pickup device, said image pickup unit being independent from thelens unit and attached to a bottom of the lens unit, wherein the imagepickup device is disposed in a substantially closed space in the imagepickup unit.
 2. A compact camera module comprising a lens unit includinga lens and a lens holder holding the lens therein and an image pickupunit attached to the lens unit, wherein the image pickup unit comprises:a circuit board; an image pickup device on the circuit board; a covermember arranged on the circuit board to cover the image pickup device;and an optical filter arranged with respect to the cover member to facethe image pickup device, wherein the image pickup device is disposed ina substantially closed space formed by the circuit board, the covermember, and the optical filter.
 3. The compact camera module as claimedin claim 2, wherein the cover member includes an air hole to make thesubstantially closed space in communication with the outside; the lensunit includes a ventilation channel; the air hole is in communicationwith the ventilation channel.
 4. The compact camera module as claimed inclaim 3, wherein the ventilation channel is formed between a wall of acutout of the lens and the lens holder.
 5. The compact camera module asclaimed in claim 4, wherein the ventilation channel has an air filterdisposed therein.
 6. The compact camera module as claimed in claim 1,wherein the image pickup unit is asymmetric with respect to a centralline.
 7. The compact camera module as claimed in claim 2, wherein theimage pickup unit is asymmetric with respect to a central line.
 8. Thecompact camera module as claimed in claim 2, wherein a groundingterminal is formed on a side surface of the circuit board, saidgrounding terminal including a portion extending to an upper surface ofthe circuit board; and the cover member is arranged to be in contactwith the portion of the grounding terminal extending to the uppersurface of the circuit board.
 9. An image pickup unit for use inconjunction with a lens unit in a compact camera module, comprising: asubstantially closed space; and an image pickup device disposed in thesubstantially closed space.
 10. An image pickup unit for use inconjunction with a lens unit in a compact camera module, comprising: acircuit board; an image pickup device on the circuit board; a covermember arranged on the circuit board to cover the image pickup device;and an optical filter arranged with respect to the cover member to facethe image pickup device, wherein the image pickup device is disposed ina substantially closed space formed by the circuit board, the covermember, and the optical filter.
 11. The image pickup unit as claimed inclaim 10, wherein the cover member includes an air hole to make thesubstantially closed space in communication with the outside.
 12. Theimage pickup unit as claimed in claim 10, wherein the image pickup unitis asymmetric with respect to a central line.
 13. The image pickup unitas claimed in claim 10, wherein a grounding terminal is formed on a sidesurface of the circuit board, said grounding terminal including aportion extending to an upper surface of the circuit board; and thecover member is arranged to be in contact with the portion of thegrounding terminal extending to the upper surface of the circuit board.14. A lens unit for use in conjunction with an image pickup unit in acompact camera module, comprising: a lens having a cutout; and a lensholder that holds the lens therein, wherein a ventilation channel isformed between a wall of the cutout and the lens holder.
 15. The lensunit as claimed in claim 14, wherein the ventilation channel has an airfilter disposed therein.
 16. A method of producing a compact cameramodule, comprising the steps of: forming an image pickup unit wherein animage pickup device is disposed in a substantially closed substantiallyclosed space; and attaching the image pickup unit to a lens unit. 17.The method of producing the compact camera module as claimed in claim16, wherein the step of forming the image pickup unit comprises thesteps of: installing an image pickup device on a circuit board; coveringthe image pickup device with a cover member to form the substantiallyclosed substantially closed space; and arranging an optical filter withrespect to the cover member to face the image pickup device.
 18. Themethod of producing the compact camera module as claimed in claim 17,wherein the cover member includes an air hole to make the substantiallyclosed space in communication with the outside.
 19. A method ofproducing an image pickup unit for use in conjunction with a lens unitin a compact camera module, the method comprising the steps of:installing an image pickup device on a circuit board; covering the imagepickup device with a cover member to dispose the image pickup device ina substantially closed space; and arranging an optical filter withrespect to the cover member to face the image pickup device.
 20. Themethod as claimed in claim 19, wherein the cover member includes an airhole to make the substantially closed space in communication with theoutside.